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Thermomechanical Stresses in Copper Interconnect/Low-κDielectric Systems

Published online by Cambridge University Press:  17 March 2011

Y.-L. Shen  and
E. S. Ege
Y.-L. Shen
Affiliation:
Department of Mechanical Engineering, University of New Mexico Albuquerque, NM 87131, U.S.A
E. S. Ege
Affiliation:
Department of Mechanical Engineering, University of New Mexico Albuquerque, NM 87131, U.S.A
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Abstract

Numerical simulations of thermal stresses in copper interconnect and low-κdielectric systems are carried out. The analyses include two- andthree-dimensional finite element modeling of the interconnect structure.Various combinations of metal, oxide and polymer-based low-κ dielectricschemes are considered in the simulation. The evolution of stresses anddeformation pattern in copper, barrier layers, and the dielectrics arecritically assessed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F6.26
Copyright
Copyright © Materials Research Society 2004

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