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Spatially transient stress effects in thin films by X-ray diffraction

Published online by Cambridge University Press:  01 March 2012

C. E. Murray ,
C. C. Goldsmith  and
I. C. Noyan
C. E. Murray
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, New York 10598
C. C. Goldsmith
Affiliation:
IBM, Microelectronics Division, Hopewell Junction, New York 12533
I. C. Noyan
Affiliation:
Columbia University, Department of Applied Physics and Applied Mathmatics, New York, New York 10027
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Abstract

We present a review of the application of diffraction stress∕strain analysis to small volumes. For cases in which the material properties and∕or the stress state are not homogeneous, traditional approaches may yield erroneous stress results. On the other hand, with proper care, relevant mechanical information about the system can be obtained. Through the use of conventional and synchrotron-based X-ray methods, we can determine the amount of strain transfer between thin film features that possess heterogeneous stress distributions and the underlying substrate. Two examples of such studies are presented. The resulting data are used to assess the validity of several models often used to predict the mechanical behavior in thin film∕substrate composites.

Type
Strain/Stress Analysis
Information
Powder Diffraction , Volume 20 , Issue 2 , June 2005 , pp. 112 - 116
Copyright
Copyright © Cambridge University Press 2005

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