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Annealing behaviour of boron implanted defects in Si detector:impact on breakdown performance

Published online by Cambridge University Press:  15 March 2002

S. Chatterji
Affiliation:
Centre for Detector and Related Software Technology, Department of Physics, University of Delhi, Delhi-110007, India
A. Bhardwaj
Affiliation:
Centre for Detector and Related Software Technology, Department of Physics, University of Delhi, Delhi-110007, India
K. Ranjan
Affiliation:
Centre for Detector and Related Software Technology, Department of Physics, University of Delhi, Delhi-110007, India
Namrata
Affiliation:
Centre for Detector and Related Software Technology, Department of Physics, University of Delhi, Delhi-110007, India
A. K. Srivastava
Affiliation:
Centre for Detector and Related Software Technology, Department of Physics, University of Delhi, Delhi-110007, India
R. K. Shivpuri*
Affiliation:
Centre for Detector and Related Software Technology, Department of Physics, University of Delhi, Delhi-110007, India
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Abstract

Electrical properties of a device depend primarily on the active dopant concentration; understanding of the activation (annealing) process is crucial for the prediction of device behaviour. The present paper reports results from a computer based simulation approach to improve the breakdown performance of the device by studying the annealing behaviour of boron implanted in silicon. In order to have deep insight of the effect of defect complexes on the device performance, extended defect model has been incorporated in the simulation program. Optimization of annealing time, annealing temperature and dose has been performed, for the first time, incorporating a complete set of process induced defects like {113} defects, interface traps, dislocation loops and the optimization has been validated in terms of the breakdown performance of the device.

Keywords

Type
Research Article
Copyright
© EDP Sciences, 2002

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References

Cowern, N.E.B. et al., Mater. Sci. Semicond. Proc. 2, 369 (1999). CrossRef
Eaglesham, D.J. et al., Appl. Phys. Lett. 65, 2305 (1994). CrossRef
Stolk, P.A. et al., J. Appl. Phys. 81, 6031 (1997). CrossRef
Claverie, A. et al., Nucl. Instrum. Methods B 147, 1 (1999). CrossRef
TMA, TSUPREM4 V. 1999.4, User manual, 1999.
TMA-MEDICI V. 2000.4, User manual, February 2000.
A. Bhardwaj, K. Ranjan, S. Chatterji, A.K. Srivastava, R.K. Shivpuri, CMS NOTE 2001/015 (2001).
Ranjan, K., Bhardwaj, A., Chatterji, S., Srivastava, A.K., Shivpuri, R.K., Semicond. Sci. Technol. 16, 635 (2001).
Huang, R.Y.S. et al., J. Appl. Phys. 74, 5821 (1993). CrossRef
Rafferty, C.S. et al., Appl. Phys. Lett. 68, 2395 (1996). CrossRef
Herner, S.B. et al., J. Appl. Phys. 83, 6182 (1998). CrossRef
Giles, M.D., J. Electrochem. Soc. 138, 1160 (1991). CrossRef
Y. Oh et al., IEDM Tech. Dig. 509 (1998).
Robertson, L.S. et al., Appl. Phys. Lett. 75, 3844 (1999). CrossRef
Eaglesham, D.J. et al., Nucl. Instrum. Methods B 106, 191 (1995). CrossRef
Privitera, V. et al., Mater. Sci. Semicond. Proc. 2, 35 (1999). CrossRef
S.M. Sze, Physics of Semiconductor Devices (McGraw-Hill Book Company, 1969), Vol. 19, pp. 68-70.
J. Bourgoin, M. Lanno, Point Defects in Semiconductors (Springer-Verlag, 1983), Vol. II, p. 266.
G. Holmen, S. Peterstrom., in Fifth International Conference on Ion Implantation, edited by F. Chernow, J. Borders, D. Brice (Plenum, New York, 1976), p. 11.
Takashi Hirao et al., in Fifth International Conference on Ion Implantation, edited by F. Chernow, J. Borders, D. Brice (Plenum, New York, 1976), p. 9.