Book contents
- Frontmatter
- Contents
- Preface
- 1 Fundamentals of laser energy absorption
- 2 Lasers and optics
- 3 Thermal processes in laser–materials interactions
- 4 Desorption at low laser energy densities
- 5 Dynamics of laser ablation
- 6 Ultrafast-laser interactions with materials
- 7 Laser processing of thin semiconductor films
- 8 Laser-induced surface modification
- 9 Laser processing of organic materials
- 10 Pulsed-laser interaction with liquids
- 11 Laser cleaning of particulate contaminants
- 12 Laser interactions with nanoparticles
- 13 Laser-assisted microprocessing
- 14 Nano-structuring using pulsed laser radiation
- Index
- References
2 - Lasers and optics
Published online by Cambridge University Press: 04 December 2009
Book contents
- Frontmatter
- Contents
- Preface
- 1 Fundamentals of laser energy absorption
- 2 Lasers and optics
- 3 Thermal processes in laser–materials interactions
- 4 Desorption at low laser energy densities
- 5 Dynamics of laser ablation
- 6 Ultrafast-laser interactions with materials
- 7 Laser processing of thin semiconductor films
- 8 Laser-induced surface modification
- 9 Laser processing of organic materials
- 10 Pulsed-laser interaction with liquids
- 11 Laser cleaning of particulate contaminants
- 12 Laser interactions with nanoparticles
- 13 Laser-assisted microprocessing
- 14 Nano-structuring using pulsed laser radiation
- Index
- References
Summary
Lasers for materials processing
Lasers (the acronym from light amplification by stimulated emission of radiation), with their unique coherent, monochromatic, and collimated beam characteristics, are used in ever-expanding fields of applications. Different applications require laser beams of different pulse duration and output power. Lasers employed for materials processing range from those with a high peak power and extremely short pulse duration to lasers with high-energy continuous-wave output.
Continuous-wave – millisecond – microsecond lasers
Continuous-wave (CW) and long-pulsed lasers are typically used to process materials either at a fixed spot (penetration material removal) or in a scanning mode whereby either the beam or the target is translated. Millisecond- and microsecond-duration pulses are produced by chopping the CW laser beam or by applying an external modulated control voltage. Fixed Q-switched solid-state lasers with pulse durations from tens of microseconds to several milliseconds are often used in industrial welding and drilling applications. Continuous-wave carbon dioxide lasers (wavelength λ = 10.6μm and power in the kilowatt range) are widely employed for the cutting of bulk and thick samples of ceramics such as SiN, SiC, and metal-matrix ceramics (e.g. Duley, 1983). Continuous-wave laser radiation allows definition of grooves and cuts. On the other hand, low-power CO2 lasers in the 10–150-W range are used for marking of wood, plastics, and glasses. Argon-ion lasers operating in the visible range (λ = 419–514 nm) are utilized for trimming of thick and thin resistors. In the biomedical field various CW lasers have been used.
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- Information
- Transport in Laser MicrofabricationFundamentals and Applications, pp. 33 - 59Publisher: Cambridge University PressPrint publication year: 2009
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